How much do you know about the printed circuit board manufacturing process?

Regarding the printed circuit board, it is no stranger to trust electronic workers, it is an indispensable and important part of modern electronics.How much do you know about its production process?Let's find out.

The substrate of the printed circuit board itself is made of insulating and non-bending material, and the visible small circuit material is copper foil.During the manufacturing process of the circuit board, the remainder of the circuit board is etched into a small section.

These circuits, called wires or wires, are used to provide electrical connections to components on a circuit board.The color of the general printed circuit board is green, which is the color of the solder mask, which is an insulating protective layer that protects the copper wire to prevent the parts from being soldered to the wrong place.

The manufacturing process of a printed circuit board begins with a PCB "substrate" made of glass epoxy or similar material.The first step in fabrication is to draw the lines between the parts.The method is to "print" the negative electrode of the printed circuit board on the metal conductor by the method of negative relocation.

A layer of copper foil can eliminate the extra layer.For double-sided production, both sides must be covered with copper foil, and to make a multi-layer board, two double-sided boards can be pressed together with a special adhesive.

Next, we can drill and plate the components on the printed circuit board.After the mechanical equipment is drilled according to the drilling requirements, the lining of the hole wall must be plated through hole technology (PTH).Ensure that the inner lines of each layer of metal treatment in the hole can be connected to each other.

Before electroplating, impurities in the holes must be removed.This is because the epoxy undergoes some chemical changes when heated and it masks the inner layers of the PCB, so it should be removed first.Both cleaning and plating operations are performed in a chemical process.Next, you need to mask the outermost wires with solder mask so that the wires don't touch the plated parts.

Then, the symbol screen of each component is printed on the circuit board to symbolize the position of each component.Do not cover any wires or gold fingers, as it will reduce the stability or solderability of the current connection.In addition, if there is a metal connection, the position of the gold finger needs to be plated with gold, which can ensure high-quality connection current when inserted into the expansion slot.

Finally a quiz.To test the printed circuit board for shorts or open circuits, optoelectronic tests can be used.Optical scanning is used to detect defects on each layer, while electronic testing typically uses a flying probe to view all connections.Electronic testing is more accurate for shorts or opens, but optical testing is easier to detect incorrect voids in conductors.